DARPA-funded research into on-chip liquid cooling has resulted in a field-programmable gate array (FPGA) liquid-cooled device that can operate at 24 degrees Celsius, versus 60 degrees Celsius for an equivalent air-cooled device. The cooling fluid resides only nanometers from the heat it must address, and operates so efficiently as to offer potential to stack CPUs and GPUs using copper columns, as well as dispensing with heat-sinks and fan systems. With those components removed, the system can facilitate far more compact designs than are currently feasible.
